Indium Features InFORMS Reinforced Solder Preforms At APEC 2017

Indium will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2017, March 26^th-30^th, in Tampa, Fla.

InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.

In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:

• Four improved thermal cycling reliability compared to a solder preform-only approach
• Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
• Low-voiding of <1%
• Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment

Visit Indium at booth #525.