Design engineers working in motor drives, renewables, or energy storage systems face a balancing act: packing more power into smaller spaces while keeping efficiency high and costs low. To help address this challenge, Microchip has introduced the DualPack 3 (DP3) family of IGBT7 power modules.
The new DP3 devices are available in six versions at 1200V and 1700V, covering currents from 300A to 900A. Built on IGBT7 technology, they reduce power losses by as much as 15–20% compared with earlier IGBT4 devices, and they can withstand overload temperatures up to 175°C.
One of the biggest benefits is packaging. At just 152 × 62 × 20 mm, the DP3 modules deliver higher power density without forcing engineers to parallel multiple modules. This not only simplifies layouts but also cuts bill-of-materials costs.
The modules also tackle familiar challenges in motor drive systems — from dv/dt management and conduction losses to overload capabilities — making them suitable for industrial drives, traction, agricultural vehicles, and renewable energy converters. On top of that, their compatibility with EconoDUAL™ footprints provides a secure second-source option.
Microchip highlights that the DP3 modules can be paired with its wider portfolio of controllers, security, and connectivity solutions, enabling system-level integration and faster time to market.
buy now: https://www.microchipdirect.com/
