As AI and high-performance computing workloads continue to scale, power delivery has become a primary design constraint inside modern data centers. Engineers are being asked to deliver higher current within tighter board footprints while maintaining predictable thermal behavior and system visibility. Integrated power modules are increasingly used to meet these requirements by reducing layout complexity and improving power density at the point of load.
Microchip Technology has introduced the MCPF1525 power module, a highly integrated 16 V input buck converter designed for AI server and high-performance compute platforms. The module delivers up to 25 A per device and supports current stacking to 200 A, enabling designers to scale output power without expanding board area. The device includes PMBus and I2C interfaces for system-level monitoring and control and is targeted at applications such as PCIe switches and compute MPUs used in AI deployments.
The MCPF1525 uses a vertical package construction that prioritizes board space efficiency. According to Microchip, this approach can reduce board area by up to 40 percent compared to more traditional solutions. The module measures approximately 6.8 mm by 7.65 mm by 3.82 mm, making it suitable for space-constrained server designs where power density is a limiting factor.
Reliability features are built into the module and exposed through the PMBus interface. These include over-temperature, over-current, and over-voltage protection, allowing system controllers to detect and respond to fault conditions. The thermally enhanced package supports junction temperatures from minus 40 degrees Celsius to plus 125 degrees Celsius. An embedded EEPROM allows designers to program default power-up behavior without additional external components.
The module also integrates a custom inductor designed to minimize conducted and radiated noise. Reducing electrical noise at the power stage helps maintain signal integrity in high-speed computing environments, where errors can lead to retransmissions and unnecessary power consumption.
The MCPF1525 fits into Microchip’s broader data center portfolio, which includes PCIe Switchtec devices, FPGAs, MPUs, and Flashtec NVMe controllers. By aligning power delivery with these compute and interconnect solutions, Microchip aims to simplify system design and reduce integration risk for high-performance computing platforms.
Microchip offers a broad lineup of DC-DC power modules with input voltage ranges from 5.5 V to 70 V, available in compact and thermally optimized packages for high-density applications. Additional information on the MCPF1525 and related power modules is available through Microchip.
To learn more about Microchip’s power modules, visit the web page.
