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Embedded
MEMS VC accelerometer modules offered in standard ranges
MEMS VC accelerometer module samples, in ranges from ±2g to ±100g, is now being offered by Silicon Designs via…
Develop secure connected nodes with cryptography-enabled MCU
As the IoT accelerates and internet connectivity is deployed into virtually every industrial segment, security…
MCUs offer signal-chain elements for sensing applications
Texas Instruments has announced the addition of MCUs with integrated signal-chain elements and an extended…
High-speed MCUs with multiple packages and memory sizes
Toshiba has announced the launch of the second M3H group in the TXZ family of low-power, high-speed…
96-layer BiCS FLASH development with QLC technology
Toshiba Memory Europe has announced that it has developed a prototype sample of a 96-layer BiCS FLASH, memory…
Industry’s first SSD using 96-layer 3D flash memory
Toshiba Electronics Europe has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer,…
Innovative EDSFF data storage solutions at Flash Memory Summit
Reference design solutions for emerging enterprise data center SSD form factor (EDSFF) implementations have been…
2018 update of Embedded C Coding Standard released
The embedded systems experts, Barr Group, today released an update of the influential Embedded C Coding Standard.…
Product capabilities expanded with LynxSecure Separation Kernel Hypervisor
Supplier of processor solutions for demanding environments, Concurrent Technologies, has partnered with Lynx…
Spin-orbit torque MRAM devices fabricated on 300mm Si wafers
At this week’s 2018 Symposia on VLSI Technology and Circuits, imec will demonstrate for the first time the…