As space and thermal constraints continue to challenge modern circuit designs, component packaging has become just as critical as electrical performance. Recognizing this, Nexperia has introduced 12 new bipolar junction transistors (BJTs) in its compact clip-bonded FlatPower (CFP15B) package—positioning them as an efficient alternative to traditional MJD-style DPAK-packaged devices.
The newly launched MJPE series includes six industrial-grade and six automotive-grade BJTs, covering both NPN and PNP variants. Rated for VCEO values of 50 V, 80 V, and 100 V, and offering collector currents from 2 A to 8 A, these transistors meet the performance demands of today’s power supply, battery management, and display applications—without the board space penalty.
A Smaller Footprint Without Thermal Tradeoffs
Compared to MJD transistors in DPAK packaging, the MJPE series in CFP15B offers a 53% smaller soldering footprint. Despite the size reduction, the CFP15B maintains robust thermal performance, operating at temperatures up to 175°C for automotive use cases. This makes the new BJTs particularly attractive for multi-layer PCB designs, where managing heat in a dense layout is critical.
What sets the CFP15B apart is its clip-bonded construction—a packaging innovation that improves both thermal conductivity and mechanical stability. The result is a compact transistor that can meet the rugged requirements of automotive environments, onboard chargers, and backlight circuitry.
Design Standardization with Nexperia’s CFP Portfolio
These BJTs are the latest addition to Nexperia’s growing family of CFP-packaged devices, which also includes Schottky and recovery rectifiers. By offering standardized footprints across multiple discrete categories, Nexperia enables engineers to streamline PCB layouts and simplify component sourcing, especially in cost-sensitive or space-constrained designs.
Industry Insight
“As the industry transitions to multi-layer PCBs, a trend driven by the increasing popularity of high-performance microcontrollers, packaging has become a crucial part of the thermal system,” said Frank Matschullat, Product Group Manager for Power Bipolar Discretes at Nexperia. “Modern CFP packaging offers equal electrical performance in a considerably smaller footprint, helping to reduce part and overall system costs.”
With expanded production capacity and a clear focus on future-ready discrete components, Nexperia’s MJPE series is designed to help engineers reduce design complexity while maintaining performance headroom.
Learn More
For details on Nexperia’s complete portfolio of bipolar junction transistors, visit: https://nexperia.com/MJPE
