As semiconductor devices continue to shrink and materials research pushes into increasingly complex structures, sample preparation has become one of the most critical—and difficult—steps in analysis workflows. Achieving uniform, high-quality transmission electron microscopy (TEM) lamellae or precise cross sections requires not only accuracy, but also real-time insight into how materials respond during processing.
To address this challenge, ZEISS has introduced the Crossbeam 750 focused ion beam–scanning electron microscope (FIB-SEM), a system designed to provide continuous, high-resolution feedback during milling. The goal is straightforward: eliminate the need to pause processing to verify results, allowing engineers and researchers to make adjustments in real time.
Eliminating Interruptions in FIB Workflows
Traditional FIB-SEM workflows often require stopping the milling process to assess progress using SEM imaging. This interruption not only slows down throughput but can also introduce variability, especially when working at nanometer scales.
The Crossbeam 750 addresses this by enabling simultaneous SEM imaging during FIB milling—what ZEISS refers to as a “see while you mill” approach. With high dynamic range imaging maintained across a wide range of milling conditions, users can observe material removal in real time, from high-current bulk milling down to ultrafine polishing at low accelerating voltages.
This continuous feedback loop allows for more accurate endpoint detection, reducing the likelihood of over-milling or rework and improving first-pass success rates for TEM lamella preparation.
Supporting Advanced Semiconductor Architectures
As device architectures evolve from FinFET to gate-all-around (GAA) and complementary FET (CFET) structures, precision requirements in failure analysis and process development have tightened significantly. Features are smaller, layers are more complex, and tolerances are increasingly unforgiving.
The Crossbeam 750 is designed to meet these demands by maintaining clear SEM imaging even under challenging conditions, such as low landing energies or tilted sample geometries. This enables engineers to monitor FIB-sample interactions directly and make fine adjustments during thinning and polishing.
For leading-node logic and memory devices, this level of control supports consistent, nanometer-scale endpointing—critical for both frontside and backside analysis workflows, including emerging power delivery architectures.
Gemini 4 Optics and Imaging Performance
At the core of the system is the new Gemini 4 electron optics platform, which improves both resolution and signal-to-noise ratio. This is particularly important when working with delicate or low-contrast materials, where imaging clarity directly impacts the ability to interpret structures accurately.
The system also offers a large, undistorted field of view, which benefits applications such as 3D tomography and atom probe tomography (APT) sample preparation. By reducing distortion and maintaining image fidelity across a wider area, researchers can capture more complete datasets in fewer steps.
Extending Capabilities Across Materials and Life Sciences
While semiconductor analysis is a primary use case, the Crossbeam 750 is also positioned for broader applications in materials science and life sciences. These include:
- Uniform TEM lamella preparation
- APT sample preparation
- Nanofabrication workflows, including electron-beam lithography
- High-resolution 3D volume imaging
In these environments, the combination of stable low-kV performance and improved signal-to-noise ratio helps accelerate acquisition times while preserving data quality. This is particularly valuable in 3D tomography, where large datasets must be collected without introducing artifacts or distortion.
A Shift Toward Continuous Feedback
The introduction of real-time SEM imaging during FIB milling reflects a broader shift in analytical workflows. Rather than relying on iterative stop-and-check processes, systems are moving toward continuous monitoring and adjustment, allowing users to stay closer to the material as it is being processed.
For engineers working at the limits of device scaling or material complexity, this approach offers a more direct path to accuracy. By reducing interruptions and improving visibility into each step of the process, tools like the Crossbeam 750 help streamline workflows while improving overall yield and consistency.
As advanced manufacturing and research continue to demand higher precision, integrated imaging and processing capabilities are becoming less of an advantage and more of a requirement.
