Liquid cooling and temperature control for semiconductor process equipment

Laird has developed custom cooling and temperature control systems for semiconductor fabrication equipment. The critical production tools used in semiconductor fabrication facilities must be reliable and easy to service to minimize downtime. Laird’s custom liquid cooling systems for semiconductor tools – which can include heat exchangers, pumps, sensors, thermoelectric modules, thermoelectric assemblies, thermoelectric chillers, compressors, flow controllers, temperature controllers, and more – are specifically designed to keep these tools running…

August 24, 2016
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Thermal management solution offers precise temperature control

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August 12, 2016

Laird has simplified the product selection and thermal design process by offering standard and custom thermal management solutions that offer precise temperature control to optimize the performance of liquid chromatography equipment. Depending on the heat load capacity requirements of the High Performance Liquid Chromatography (HPLC) equipment, these thermal systems are comprised of Laird’s advanced SR-54 series temperature controller in combination with either the Tunnel series or PowerCool series Thermoelectric Assemblies…

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Higher intermediate rings accommodate USB connectors

August 9, 2016

Higher intermediate rings that can accommodate USB and micro USB connectors have been introduced by OKW, extending its MINITEC handheld enclosures range. MINITEC is suited for remote control systems, data recording, medical electronics, emergency systems, monitoring and alarms. MINITEC already offers a huge range of standard permutations thanks to its construction format. Each case features a top section, bottom section and an intermediate ring. This reduces the need for customization….

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Conduction Cooled ATRs and Specialty Enclosures

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May 4, 2016

Pixus Technologies has announced new conduction cooled chassis in the ATR format or in specialty Small Form Factor (SFF) designs. Enclosures formats are available for both OpenVPX and MicroTCA architectures. The Pixus conduction-cooled ATRs come in standard 1/2 and 3/4 sizes for 3U or 6U boards. There are also options for the MicroTCA.3 Hardened form factor as well as heat exchanged versions. The enclosures are designed to meet MIL-STD-704, MIL-STD-810G,…

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Pixus upgrades 13U ATCA Chassis

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March 17, 2016

Pixus Technologies has made several upgrades to its latest generation of AdvancedTCA (ATCA) enclosure system. The changes include new 40GbE backplane, shelf manager, and Power Entry Module (PEM) options. The Pixus PXS13X0 series AdvancedTCA chassis now comes with 40GbE backplane options to IEEE 40GBASE-KR4. Featuring patented RiCool III fans options, the chassis cools over 300W/slot while maintaining NEBS compliance and CPTA design guidelines. The enclosures also have new shelf manager…

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