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When we think of jumping robots, we often imagine mechanical legs or spring-loaded limbs launching skyward. But what if a robot could jump 10 feet into the air—without any legs at all? That’s exactly the challenge researchers at Georgia…

RS7 MOSFETs provide low on-resistance, a robust, high-power DFN5060T8LSHAAE package, Pb-free plating, and Halogen-free construction. These modules are built for high-efficiency performance in motor drives, switching applications, and DC/DC…

As electric vehicles (EVs) push toward higher performance and longer range, the demands placed on onboard chargers (OBCs) continue to grow. Higher battery voltages require faster charging rates, while design constraints call for smaller,…

The rise of AI isn’t just driving demand for faster chips—it's reshaping the very architecture of data centers. From power delivery to connectivity, nearly every piece of infrastructure must now handle workloads that are larger, faster, and…

With advanced packaging, 3D chip stacking, and record-setting performance, TSMC’s A14 technology lays groundwork for 2028 and beyond — just as global chip policy and trade dynamics shift.

As modern electronics—especially in automotive, industrial, and consumer applications—become increasingly complex and miniaturized, selecting the right transient protection device is critical. Engineers face more than just component…

As vehicles become more electrically complex, safeguarding sensitive systems from voltage transients remains a priority for design engineers. This week, Bourns introduced a new series of automotive-grade multilayer varistors (MLVs) designed…

At Auto Shanghai 2025, Intel introduced its second-generation AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), marking a significant advancement in automotive computing. This new SoC is the industry's first to utilize a…

In high-performance computing, the hottest topic is staying cool. A startup spun out of Georgia Tech is changing the way we think about thermal management with a breakthrough cooling system that directly targets heat where it matters most:…

While most of the world sees electric vehicles (EVs) as just a greener way to commute, a growing number of engineers are looking under the hood and seeing something else: untapped grid infrastructure on wheels. This is what vehicle-to-grid…

For embedded engineers looking to streamline wireless communication in IoT and smart devices, integrating both Wi-Fi and Bluetooth® LE in a power-efficient, compact form factor can be a challenge—especially without reinventing the hardware…

When you’re designing for space, defense, or high-reliability aviation systems, the standards are different. Every component must function not just well—but flawlessly—under pressure, extreme temperatures, vibration, and long mission…

Kawasaki is rethinking personal mobility—by removing the wheels altogether. Meet CORLEO, a hydrogen-powered, quadruped robotic vehicle designed to carry a human rider across terrains where traditional transport falls short. Blending…

As connected devices grow smaller, smarter, and more demanding, one critical component has struggled to keep pace: the battery. But a breakthrough in solid-state energy storage may soon change that. France-based ITEN, a company…

Alphawave Semi is accelerating the evolution of high-performance data infrastructure with a new wave of connectivity solutions engineered for AI, compute, and networking systems. From ultra-fast SerDes to chiplet-compatible die-to-die IP,…