AMICRA Microtechnologies is entering a new era of growth and market capitalization by becoming a part of ASM Pacific Technology. Effective April 2018, the company was renamed ASM AMICRA Microtechnologies. The well-known and proven AMICRA management team, consisting of Dr. Johann Weinhaendler, Rudolf Kaiser and Horst Lapsien, remains in place.
The acquisition of 100% of the shares of AMICRA Microtechnologies by Singapore-based ASM Pacific Technology. (ASMPT) will considerably expand and strengthen AMICRA’s strategic position. ASMPT, as an innovative and quality-driven strategic investor in the electronics manufacturing industry having a well-developed distribution network in Asia, complements AMICRA’s technology position and worldwide business activities very well. The transaction will especially serve the fast growing silicon photonics assembly equipment market but also the general high-precision flip-chip and die bonding markets.
ASMPT, headquartered in Singapore and listed on the Hong Kong Stock Exchange, is the world’s largest back-end semiconductor equipment supplier and SMT solutions provider. ASM AMICRA Microtechnologies GmbH will be integrated into ASMPT’s back-end equipment segment. AMICRA’s corporate structure and global organization will remain in place, as well its long-time proven management team.
AMICRA started out in 2001 with five employees. In the mean time, it has developed into an internationally known vendor and leading supplier of high-precision die bonders for the advanced packaging and photonics assembly market. AMICRA now employs 130 at its headquarters in Regensburg, Germany, and in twelve sales and tech support offices around the world. AMICRA products will now constitute an important growth factor for the global leader in back-end equipment.
ASMPT’s commanding market position is based on its continued technological innovation, its foresight in investing ahead of the curve, commitment to quality, and strong value-adding services to customers.
ASMPT currently invests about ten percent of its revenues in R&D. This makes it an ideal partner for an innovation and technology leader in photonics and optical device packaging such as AMICRA.
Following its successful penetration of the worldwide markets for high-precision die-attach equipment, especially in the rapidly growing silicon photonics assembly segment, AMICRA saw a perfect opportunity to merge with a strong strategic partner to better support its growing international customers base. With ASMPT’s economic scale and well established supply chains and customer support capabilities, this will allow AMICRA to take the next step in the development of its business.
Dr Johann Weinhaendler, a member of the AMICRA executive management team, stated: “We are delighted to work with ASMPT. The expanded operational base offered by ASMPT is very important to us. We will continue to be a reliable partner to our existing and new customers focused on their specific needs and requirements.
“We will continue to offer excellent support, as well as innovative solutions. AMICRA’s sub-micron high-accuracy die bonder product is complementary to the ASMPT group’s existing portfolio and the AMICRAs leading position in the photonics assembly market, gives a high growth potential for AMICRA and ASMPT. We are confident that this joining of forces will further strengthen our growth opportunities and deliver even higher added value to our common customers.”
