eeDesignIt Editorial 319 posts 0 comments

Designing an AI chip doesn’t begin in a cleanroom. It starts long before tape-out, when engineers are mapping workloads, testing architectural options, and weighing trade-offs on paper and in simulation. That early phase, the pre-silicon…

Data centers are hitting a thermal wall. Racks that once drew 5 to 10 kilowatts now commonly exceed 50 kW, with some hyperscale and HPC deployments pushing past 100 kW. Air-based cooling systems designed for lower densities can’t keep up.…

In rugged embedded systems, space is always at a premium. Defense and aerospace designers, in particular, face the ongoing challenge of packing more processing power into tighter, lighter platforms without sacrificing reliability. Power…

For decades, power electronics have been built around silicon. But as engineers push systems to handle higher voltages, temperatures, and frequencies, silicon’s limits have become impossible to ignore. That’s why silicon carbide (SiC) has…

Imagine an antenna that embeds intelligence in its flexibility: stretch, twist, or compress it—and suddenly it speaks in a different frequency band. That’s exactly what a team at MIT has created, with a shape-changing antenna that rewrites…

Automotive and industrial electronics often juggle space constraints, heat, and vibration—all while needing both signal and power lines in one compact interface. Hirose’s ZE05 (Hybrid) series answers that challenge with streamlined…

If there’s one thing that keeps server and telecom designers awake at night, it’s power reliability. A single misstep on a 12-volt rail can mean downtime, fried components, or costly system replacements. In massive data centers, where…

For decades, making electronic circuits has been a story of heat. Whether it’s firing up silicon wafers in furnaces, baking on conductive films, or sputtering metals under vacuum, the process has always relied on high temperatures and…

It’s a familiar sight: dust building up on a window, a solar panel, or the windshield of a car. It dulls visibility, saps energy efficiency, and demands time, water, and effort to clean. But now, a new type of glass could make those…

There’s a new actuator design out of POSTECH that’s worth paying attention to. It’s ultra-thin—around the thickness of a sheet of paper—but it’s capable of complex, controlled motion in multiple directions. The concept is inspired by how…

Renesas has released the RZ/G3E, a 64-bit microprocessor aimed squarely at developers building advanced HMI systems that need strong graphics capabilities, fast boot times, and robust connectivity at the edge. Built around a quad-core Arm®…

Designing a part that’s both lightweight and strong is both a great promise of 3D printing and one of its biggest frustrations. Especially when it comes to gyroid infill. These complex internal structures look great in theory and perform…

As data centers, industrial systems, and PoE devices push the limits of performance, the pressure is on for circuit protection to keep up. Littelfuse has answered that challenge with the launch of its new 5.0SMDJ-FB TVS Diode Series,…

Storage just got smaller—and a whole lot faster. Silicon Motion’s new FerriSSD® PCIe Gen4 NVMe BGA SSD delivers blazing-fast performance in a compact package designed for embedded and industrial systems where size and reliability matter…

Imagine walking into a room and being identified instantly—without a camera, facial recognition, or even saying a word. Not in a creepy dystopian way, but through the invisible signals all around us. That’s the premise behind WhoFi, a new…