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RTOS designed for R-Car D3 SoC for graphical instrument clusters
RTOS enables safe and secure run-time architecture and development tools for high-performance automotive graphics…
Hypervisor foundation created for platform software solution
Lynx Software Technologies provide hypervisor foundation for the ETAS RTA-VRTE platform software solution…
Broadcom’s Qualcomm bid takes another twist
The saga surrounding Broadcom’s proposed bid for Qualcomm has ramped up over the last few days in the build up to…
CEVA and Nokia collaborate for 4.9G and 5G technologies
CEVA is supporting Nokia in the development of its ReefShark baseband System-on-Chips (SoCs), set to be deployed…
Small and secure RF modules for embedded applications
Solid State Supplies now offers the XBee3 embedded RF modules from Digi. The modules ease the design task with…
New Drone Standards in 2018 set to revolutionise UK and global economies
New Drone Standards are to be unveiled for the first time in Spring 2018 which are expected to lead to strengthened…
Imec and Cadence design the industry’s first 3nm test chip tapeout
Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.
Binder ELC series 570 prevents mismating with intuitive locking system
The binder ELC series 570 has an intuitive locking system to ensure positive mating with miss-mating being…
emCompress-ToGo added to emCompress compression software family
SEGGER has announced emCompress-ToGo, a new member of the emCompress compression software family.
Microsemi expand growing SiC discretes and modules portfolio
New devices ideally suited for power applications in rugged environments to be showcased in booth 1147 at APEC…