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Quadrupling the capabilities of multicore technology for the rollout of 5G
A strategic roadmap to quadruple the capabilities of our unique multicore technology to address the mature stage of…
S3 Semiconductors SmartEdge platform delivers optimized edge computing
S3 Semiconductors has announced the introduction of its SmartEdge Platform, giving its customers access to…
Flexible board-to-board interconnect solutions for industrial tasks
Archer Kontrol family of board-to-board connectors presents design engineers with highly robust, as well as…
Debugging development tool features faster programming
New tool from Microchip Technology features faster programming, wider voltage range and improved interface options.
CEVA extends its IP platforms for Bluetooth and WiFi with RISC-V
CEVA has announced that its market-leading RivieraWaves Bluetooth and WiFi intellectual property (IP) platforms are…
Highly reliable metal alloy resistors achieve 50% higher power rating
TT Electronics, a global provider of engineered electronics for performance critical applications, has announced…
Solutions for engineers looking for quick and easy adoption of USB-C
ON Semiconductor has announced the latest set of USB-C (Type-C) devices that are fully compliant with the latest…
Smallest step-down power module shrinks board space up to 58%
Texas Instruments has introduced two new 4 to 36V power modules that measure just 3.0x3.8mm and require only two…
CEVA and mPerpetuo partner to deliver Halide support for CEVA vision processors
Companies collaborate to enable CEVA-XM family with Halide functionality, dramatically improving productivity and…
Murata teams with Altair and STMicroelectronics to develop IoT solutions
Murata has announced that it has selected Altair Semiconductor's dual-mode CAT-M1/NB1 chipset and…