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New Drone Standards in 2018 set to revolutionise UK and global economies
New Drone Standards are to be unveiled for the first time in Spring 2018 which are expected to lead to strengthened…
Imec and Cadence design the industry’s first 3nm test chip tapeout
Extreme ultraviolet and 193 immersion lithography technology and Cadence digital tools used to design 3nm CPU core.
Binder ELC series 570 prevents mismating with intuitive locking system
The binder ELC series 570 has an intuitive locking system to ensure positive mating with miss-mating being…
emCompress-ToGo added to emCompress compression software family
SEGGER has announced emCompress-ToGo, a new member of the emCompress compression software family.
Microsemi expand growing SiC discretes and modules portfolio
New devices ideally suited for power applications in rugged environments to be showcased in booth 1147 at APEC…
Noise-immune capacitive-sensing MCUs bring touch control
MSP430 microcontrollers with CapTIvate technology offer value and performance to applications exposed to…
An important step-change in the way complex equipment is designed
AutomationML represents an important step-change in the way complex equipment is designed, installed and…
Fully optimized voice activation offers exceptional power efficiency
CEVA has announced the availability of the Nuance AI-powered wake-up and voice activation technology suite.
Quadrupling the capabilities of multicore technology for the rollout of 5G
A strategic roadmap to quadruple the capabilities of our unique multicore technology to address the mature stage of…
S3 Semiconductors SmartEdge platform delivers optimized edge computing
S3 Semiconductors has announced the introduction of its SmartEdge Platform, giving its customers access to…