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Software/Hardware
Software/Hardware news covering computer learning, data centers, design, embedded technology and Integrated Circuits (IC).
Load cell offers compatibility with market standard
HBM’s Z6R bending beam load cell has been designed for maximum capacities ranging from 20 to 200kg. It contains a…
Develop secure connected nodes with cryptography-enabled MCU
As the IoT accelerates and internet connectivity is deployed into virtually every industrial segment, security…
MCUs offer signal-chain elements for sensing applications
Texas Instruments has announced the addition of MCUs with integrated signal-chain elements and an extended…
Portfolio replaces oscillators, buffers and complete clock trees
Silicon Labs has expanded its Si5332 any-frequency clock portfolio with new versions combining the clock IC and a…
High-speed MCUs with multiple packages and memory sizes
Toshiba has announced the launch of the second M3H group in the TXZ family of low-power, high-speed…
Accelerating 3nm process development with DTCO innovations
Synopsys has announced a collaboration with IBM to apply design technology co-optimization (DTCO) to the…
Audio switch and amplifiers for USB-C applications
ON Semiconductor has announced two new products that can be used together in USB-C (Type-C) applications while…
96-layer BiCS FLASH development with QLC technology
Toshiba Memory Europe has announced that it has developed a prototype sample of a 96-layer BiCS FLASH, memory…
Industry’s first SSD using 96-layer 3D flash memory
Toshiba Electronics Europe has introduced a new lineup of solid state drives (SSDs) that are based on its 96-layer,…
Innovative EDSFF data storage solutions at Flash Memory Summit
Reference design solutions for emerging enterprise data center SSD form factor (EDSFF) implementations have been…