Advanced packaging has entered its most successful era boosted by need for better integration, the end of Moore’s law and, beyond that, the megatrends, transportation, 5G, consumer, memory and computing, AI & HPC.
The market today is dominated by large IDMs, such as Intel and Samsung, top four global OSATs and foundry with packaging house, TSMC, which jointly accounted for 62% of the total advanced packaging revenue. These leaders are working on numerous innovative advanced packaging platforms such as flip-chip BGA, Fan-Out packaging, and 3D TSV, to answer to the market needs. Each platform has a lot of momentum but has different potential and different characteristics.
A few years ago, Yole Développement (Yole) and NCAP China decided to create a place in the world where leading companies could share their vision of the industry, evaluate the emerging platforms, and identify business opportunities.
Today, both partners have confirmed their success with the fifth Advanced Packaging & System Integration Technology Symposium. Yole and NCAP China have combined their expertise to offer a powerful program directly related to the impact of megatrends on the advanced packaging industry.
With access to leading players and experts, the Advanced Packaging & System Integration Technology Symposium will take place in Shanghai at the end of the month and presents five key industry focuses: AI & HPC, memory and computing, transportation, 5G and consumer. The Organizing Committee is offering about 20 inspiring presentations, two market briefings and several networking times to cover a broad range of topics.
In 2015, the Fan-Out market was small and consisted mostly of standard devices like BB, RF, and PMU. But after TSMC’s 2016 game-changer with inFO for Apple’s iPhone APE, the market value increased four times by 2018. Thus, the HD Fan-Out market segment was created, reducing the market-share ratio of OSATs.
Today, the fastest growing platform is Fan-Out packaging, with 25% CAGR growth and experiencing a diversification of its targeted applications beyond the consumer world. Moreover, this year Fan-Out packaging appears once again to be one of the most dynamic technologies, though needing a new wave of cost decreases to become even more widespread. This shall be achieved thanks to the move toward panel scale, once ambitious challenges have been overcome by the industry. The Fan-out market will reach almost $3.8bn by 2024.
The Advanced Packaging & System Integration Technology Symposium program follows the industry evolution and the emergence of innovative technologies. Based on the Fan-Out attractiveness, Yole and NCAP China propose several impressive presentations focused on this advanced packaging platform, especially with Bosch Sensortec’s keynote presentation: Mrs Bin Fu, Head of Business Development and Marketing, China, at Bosch Sensortec will take a closer look at how smarter sensors can contribute to the edge IoT edge trend, from the perspective of a sensor solution innovator.
In parallel, Farhang Yazdani, President and CTO, Broadpak, will be delivering the keynote presentation dedicated to the AI & HPC megatrend.
Farhang Yazdani from Broadpak, said: “Semiconductor industry is at a turning point: the slowdown in CMOS scaling and escalated costs have prompted the industry to rely on IC packaging industry to extend the benefits of more-than-Moore era.”
Yole Développement’s packaging and substrate analysts invite everyone to gain an in-depth understanding of the industry evolution and technology issues, with two dedicated market briefings focused on AI and HPC, memory and computing, transportation, consumer and 5G, moderated by Yole’s Semiconductor and Software team.
They will describe the new ecosystem currently emerging, pushed by the needs of innovative and disruptive technologies. Analysts will also detail the industry evolution and its consequence at each step of the supply chain.
