PCB Executive Forum focuses on critical issues

IPC – Association Connecting Electronics Industries announces the PCB Executive Forum Presented by IPC Hall of Fame. This is a learning and networking forum for senior-level executives of PCB organizations, fabricators, and their suppliers. The forum will take place February 13th at IPC APEX EXPO in San Diego, Calif.

Top on the agenda is delivering insight into and information on how PCB companies can survive and thrive in today’s business environment. Presentations will cover: using venture capital funding for small businesses with big ideas, disruptive technologies, 3D printing, fabricators and their supply chain in China, flexible hybrid electronics, product reliability, industry challenges and more. Speakers include: Brad Bourne, FTG Circuits; Mike Mayer, Continental; Joan Vrtis, Multek, Inc.; Dan Feinberg, Fein-Line Associates, Hamed El-Abd, WKK Distribution; and Paul Semenza, NextFlex.

“We’re at a pivotal time in our industry when the choices company leaders make today will have a tremendous impact on whether the company remains competitive or even survives tomorrow,” says Gene Weiner, PCB Executive Forum program chair. “The industry experts we’ve assembled for this event will provide important insight on critical issues such as market trends, technology, customer requirements and the economy – issues that decision makers are facing right now.”

Forum speaker Alan Rae, Ph.D., executive director at Incubator Works, echoes the sentiment, “The electronics industry is in the middle of many transitions – desktops to handhelds, local hard drives to the cloud, the end of Moore’s law, the Internet of Everything and the rise of non-traditional ways of producing circuits. This is a time of great challenge and of great opportunity. It’s time to take a deep breath and review some of these opportunities and the PCB Executive Forum is the perfect event to do so!”

More information and registration for the PCB Executive Forum here.

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