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CHANDLER, Ariz., March 25, 2015 — Microchip Technology Inc., a leading provider of microcontroller, mixed-signal, analog and Flash-IP solutions, today announced that the MOST® Cooperation released its MOST150 technology coaxial…

Infineon Technologies AG (FSE: IFX / OTCQX: IFNNY) today announced that it supplies the embedded Secure Element (eSE) chip for the new premium smartphones Samsung Galaxy S6 and S6 edge. Infineon’s SLE 97 is a SOLID FLASH™-based eSE chip…

Toshiba America Electronic Components, Inc. announced the RBTZ2100-1MA and RBTZ2100-2MA starter kits for development of a wide range of applications using the Toshiba TZ2100 Application Processor Lite (ApP Lite™) series . The kits include…

DALLAS, -- Texas Instruments (TI) (NASDAQ: TXN) today introduced the industry's first cable driver to support uncompressed 4K ultra high definition (UHD) video transmission using serial digital interface (SDI) and 10 gigabit Ethernet (GbE)…

DALLAS, -- Texas Instruments (TI) (NASDAQ: TXN) today introduced a four-channel buck DC/DC converter with PMBus/I2C digital interface for applications in space-constrained equipment that experience high ambient operating temperature without…

Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, announced today the availability of its next generation PowerTrench® MOSFETs for automotive applications in the high-power TO-Leadless…

Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, today introduced its 800V SuperFET® II MOSFET family, featuring broad package offerings and the industry's lowest on-resistance (RDS(ON))…

BOISE, Idaho -- Micron Technology, Inc. (Nasdaq:MU), today announced the availability of ultra reliable, ultra high-speed and ultra high-temperature parallel NOR Flash and low-power DDR4 (LPDDR4) DRAM to meet the increasing memory…

CHARLOTTE, NC – ON Semiconductor (Nasdaq: ONNN), driving energy efficient innovations, and power conversion specialist Transphorm, building on their previously announced partnership to bring gallium nitride (GaN) based power solutions to…

TDK Corporation presents new EPCOS SMT transponder coils with extremely compact dimensions: Measuring just 4.5 mm x 3.2 mm x 3.2 mm, the TC1812 has an inductance of 2.38 mH and is designed for operation in the Z-axis. The TC1210 coil is…

C&K Components, a leading global manufacturer of electromechanical switches, smart card interconnect devices, and high reliability connectors, has introduced the new CCM01 MK5 Series low-profile smart card connectors. Compatible with…

Texas Instruments introduced the industry's first zero standby power controller chipset with the lowest standby power consumption for AC/DC flyback power supplies up to 75 W. Taking power supply efficiency to the next level, the new…

AUSTIN, Texas – Freescale Semiconductor has expanded its Kinetis L series with the new KL17 and KL27 ARM® Cortex®-M0+-based MCUs, combining low-power analog and connectivity features with ultra-small packaging options. The USB-enabled…

IRVINE, Calif., Broadcom Corporation (NASDAQ: BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced it is powering the first Ultra High Definition (Ultra HD) Android TV set-top…

SAN JOSE, Calif. – Fairchild (NASDAQ: FCS), a leading global supplier of high-performance power semiconductor solutions, is enabling manufacturers to improve the reliability and performance of their products with its expanded line of…