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Design
Advancement in I/O technology expected to be widely adopted for ADAS
Microsemi’s new development platform enables customers to immediately begin PCIe Gen 4 system hardware designs…
NVMe-based chipset solutions will accelerate the time to market
Marvell is launching innovative NVMe-based chipset solutions that will accelerate the time to market for…
MIPI-CSI 2 Kit eases integration of embedded vision technology
congatec has introduced its first embedded x86-based MIPI-CSI 2 Kit that eases the integration of embedded vision…
Vicor’s power-on-package system provides up to 1,000A peak current
Vicor has announced a new Power-on-Package ('PoP') ChiP-set including Modular Current Multipliers ('MCMs') for high…
Image sensor enables new functionality for industrial camera design
ON Semiconductor has announced its X-Class image sensor platform, which allows a single camera design to support…
Printed electronics on the rise: The highlights of LOPEC 2018
From March 13 to 15, 2018, the 10th edition of LOPEC, the International Exhibiton and Conference for the Printed…
Double-insulated tools keep technicians safe
Cementex, the safety tool specialists, has announced the release of the TR-9ELK-ZC Basic Electrician’s nine-piece…
Innovative tool enables precise selection of the right O-ring material
The Engineered Materials Group of Parker Hannifin has announced the availability of a new web-based engineering…
Industry’s first 16-port 50GbE Ethernet Physical Layer (PHY) transceiver
Marvell has announced the launch of the 88X7120, the latest offering in its Alaska C family of high-speed Ethernet…
DSM optimized software implementation integrated into smartphone SoC
CEVA has announced the availability of Dynamic Speaker Management (DSM) software from Maxim Integrated Products.