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Teledyne Introduces Configuration and Data Analysis Software
Teledyne SP Devices has announced the release of Digitizer Studio, a versatile and easy-to-use software for the…
North American PCB Industry Sales up 3.7% in March
IPC has announced the March 2020 findings from its North American Printed Circuit Board (PCB) Statistical Program.…
Memory Market Not to Exceed 2018 High Until 2022
The most current 2017-2024 forecast for 33 major IC product segments (e.g., DRAM, 16-bit MCUs, power management…
Compute Express Link IP Solution for Data-Intensive SoCs
Synopsys announced availability of its complete DesignWare Compute Express Link (CXL) IP solution consisting of…
Memory Forecast to Account for 43% of 2019 Semi Spending
Capex spending for memory ICs was the driving factor behind very strong increases in industry-wide capex spending…
On the Edge of Chaos, New Electronic Brain-like Systems for Complex Computing
With ultra-low power consumption, real-time processing abilities, and low-latency response times, adaptable…
The Next Evolution of the PCIe Interface at the Flash Memory Summit
Toshiba Memory Europe announced that the company has developed what they believe to be the industry’s fastest-class…
MRAM: A Promise Beyond eFlash
Nowadays, there is broad consensus in the memory industry that the 28nm/22nm silicon lithography nodes will be the…
Harness Power of Cloud-Native Approaches for Embedded Systems Development
Specialist in delivering software for critical infrastructure, Wind River, has announced the latest enhancements to…
High-Performance GPUs to Power All-New Mac Pro
It has been announced by AMD that its new AMD Radeon Pro Vega II GPUs will be included in the all-new Mac Pro.…