Microfluidic Cooling Innovation Tackles Heat at the Chip Level

In high-performance computing, the hottest topic is staying cool.

A startup spun out of Georgia Tech is changing the way we think about thermal management with a breakthrough cooling system that directly targets heat where it matters most: the chip itself.

Developed by mechanical engineering Ph.D. Daniel Lorenzini, the liquid cooling solution uses microfluidic channels—tiny, embedded liquid pathways—to draw heat away from silicon chips with precision. Unlike traditional methods that rely on bulky fans or external heat sinks, this innovation integrates cooling right into the chip packaging.

“Our system sits directly on the silicon chips that generate the most heat,” Lorenzini explained. “The fluids move through micro-pin fins to carry away that heat efficiently and directly.”

The technology, refined in the lab of Professor Yogendra Joshi at Georgia Tech’s George W. Woodruff School of Mechanical Engineering, was awarded a patent in September 2024. Lorenzini worked with VentureLab, part of Tech’s Office of Commercialization, to turn his research into a company—EMCOOL, now based in Norcross, Georgia.

With a five-person team and growing ambitions, EMCOOL is now pursuing venture funding to scale its solutions for AI processors in modern data centers—where managing heat is not just a performance issue, but a limiting factor in system design.

How It Works

The system consists of a cooling block lined with micro-pin fins on one side and a specially engineered thermal interface on the other. Fluid ports connect directly to the structure, allowing coolant to flow through the pin-finned area in tight alignment with the chip’s surface. The fluid absorbs heat and carries it away at a micro-scale level, resulting in both reduced power consumption and a lower risk of thermal failure.

Because the entire solution is compact and integrated, it improves both efficiency and reliability over conventional methods, particularly in environments with rising thermal loads—such as AI servers, gaming systems, and next-gen telecommunications hardware.

From Research to Real-World Application

Jonathan Goldman, director of Quadrant-i at Georgia Tech’s Office of Commercialization, saw the commercial potential early. With his support, Lorenzini secured grant funding from the National Science Foundation and the Georgia Research Alliance to build working prototypes and refine the design.

“Thermal management is a ubiquitous problem in computing,” Goldman noted. “What Daniel created pushes the boundaries of traditional cooling by offering a chip-scale solution that’s both compact and energy-efficient.”

The company’s early focus was the $159 billion global gaming market—where intense computing leads to performance-limiting heat. But the vision quickly expanded. Today, EMCOOL is producing custom cooling kits from its Norcross facility for applications in high-performance computing, telecom, and energy systems—all sectors in dire need of smarter heat management.

As computing power continues to grow, so too does the demand for innovation that can keep systems cool. EMCOOL’s microfluidic cooling system may be one of the most promising answers yet.

Original Story: Liquid Cooling Technology Developed at Georgia Tech Awarded U.S. Patent, Company Raising Capital to Scale | Commercialization