Intel Launches Next-Gen Automotive Chip to Power Smarter, AI-Driven Vehicles

At Auto Shanghai 2025, Intel introduced its second-generation AI-enhanced software-defined vehicle (SDV) system-on-chip (SoC), marking a significant advancement in automotive computing. This new SoC is the industry’s first to utilize a multi-process node chiplet architecture, offering automakers scalable performance, enhanced AI capabilities, and improved cost efficiency.

The chiplet-based design allows for customization of compute, graphics, and AI functionalities, enabling automakers to tailor solutions to specific vehicle requirements. Key performance improvements include up to 10 times the AI performance for generative and multimodal AI applications and up to three times the graphics performance for more immersive human-machine interfaces. Additionally, the SoC supports 12 camera lanes, enhancing image processing capabilities.

Intel also announced new collaborations with automotive innovators ModelBest and Black Sesame Technologies. ModelBest is integrating Intel’s SDV SoC and Intel® Arc™ graphics into its GUI Intelligent Agent, enabling offline, AI-enhanced voice control and personalized in-cabin interactions without the need for network connectivity. Black Sesame Technologies is combining its advanced driver-assistance systems (ADAS) technology with Intel’s SoC and graphics solutions to develop a central compute platform that merges ADAS and immersive cockpit experiences into a unified, energy-efficient system.

These developments underscore Intel’s commitment to driving innovation in the automotive sector, focusing on energy efficiency, software scalability, and enhanced user experiences as the industry moves toward fully software-defined vehicles.