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Design
Automotive grade MEMS oscillators provide 20 times better reliability
Timing precision, accuracy and tolerance to harsh environments are essential to ensuring precise operation in…
LOPEC 2018 Technical Conference: ‘Smart and hybrid systems’
eeDesignIt recently attended the international exhibition and conference for the printed electronics industry,…
The production processes that go into creating printed electronics: LOPEC 2018
There are more processes that go into printed electronics than you may think. From the production of the ink and…
LOPEC 2018: The technology that will change the world
Though they were but small, all of the printed electronics on display held promise to shake up industries and…
Advancement in I/O technology expected to be widely adopted for ADAS
Microsemi’s new development platform enables customers to immediately begin PCIe Gen 4 system hardware designs…
NVMe-based chipset solutions will accelerate the time to market
Marvell is launching innovative NVMe-based chipset solutions that will accelerate the time to market for…
MIPI-CSI 2 Kit eases integration of embedded vision technology
congatec has introduced its first embedded x86-based MIPI-CSI 2 Kit that eases the integration of embedded vision…
Vicor’s power-on-package system provides up to 1,000A peak current
Vicor has announced a new Power-on-Package ('PoP') ChiP-set including Modular Current Multipliers ('MCMs') for high…
Image sensor enables new functionality for industrial camera design
ON Semiconductor has announced its X-Class image sensor platform, which allows a single camera design to support…
Printed electronics on the rise: The highlights of LOPEC 2018
From March 13 to 15, 2018, the 10th edition of LOPEC, the International Exhibiton and Conference for the Printed…