Removing the Heat from High-Performance Packages

Specialist in the design, production, and assembly of high-performance semiconductor packages for microwave, millimeter-wave, and high-speed digital devices, StratEdge, will display its thermally-efficient line of post-fired and molded ceramic semiconductor packages in Booth 361 at the International Microwave Symposium (IMS), being held in Boston, MA, from June 4th to 6th.

StratEdge packages operate from DC to 63+ GHz and dissipate heat from compound semiconductor devices such as gallium nitride (GaN), gallium arsenide (GaAs), and silicon carbide (SiC). These packages enable compound semiconductor devices to meet the critical requirements of markets such as telecom, mixed signal, VSAT, broadband wireless, satellite, military, test and measurement, automotive, down-hole, and MEMS.

Tim Going, President of StratEdge, said: “StratEdge packages accommodate the extreme demands of compound semiconductor devices. We manufacture our packages to exacting specifications, using hardened or post-fired ceramics that don’t shrink, substrates that dissipate heat, and electrical transition designs for exceptionally low electrical losses.

“To further ensure optimized performance, StratEdge Assembly Services can package your devices in our new cleanroom, which is equipped with the latest precision wire bonding and die attach systems.”

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