eInfochips and TSMC Design Center Alliance to Accelerate Semiconductor Innovation

Arrow Electronics’ eInfochips announced it has joined the Design Center Alliance (DCA) of TSMC Open Innovation Platform® (OIP). The program focuses on chip-implementation services and system-level design solutions for those adopting TSMC technology. eInfochips brings extensive experience in successful tape-outs in TSMC’s leading-edge process technologies.

“Our collaboration with the TSMC DCA program signifies a pivotal moment for eInfochips,” said Mangesh Kulkarni, vice president and general manager of semiconductor practice at eInfochips. “It reflects our deep expertise and positions us to offer an expanded range of design and testing services, utilizing TSMC’s latest technological advancements.”

The company plans to build upon its offering of silicon engineering services through the alliance. It has been instrumental in developing next-generation SoCs, ranging from 180nm to 3nm process technologies.

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