Indium will feature its reinforced solder alloy fabrications, InFORMS, at APEC 2017, March 26th-30th, in Tampa, Fla.
InFORMS are reinforced solder preforms that increase lateral strength and stability. As a result, improved thermal cycling reliability can be achieved.
In one study where InFORMS were used to solder a DBC to the baseplate of an IGBT, the following were achieved:
- Four improved thermal cycling reliability compared to a solder preform-only approach
- Two improved thermal cycling reliability compared to a solder preform + Al wirebond stitch approach
- Low-voiding of <1%
- Lower cost of ownership – an InFORM is a drop-in replacement for a standard preform or solder paste, requiring no additional process steps or equipment
Visit Indium at booth #525.