Transphorm, Weltrend Release Integrated GaN System-in-Package at APEC 2023
The two companies teamed up to release the WT7162RHUG24A, an integrated circuit designed for use in 45-100 watt USB-C PD power adapters for charging smartphones, tablets, laptops, and other smart devices. The SiP offers peak power efficiency topping 93% and is part of a complete system from Transphorm.
Transphorm will showcase the Weltrend SiP for the first time at APEC 2023 in booth #853, along with details on the related WTDB_008 65W USB PD Power Adapter Evaluation Board.
“The WT7162RHUG24A is the industry’s first publicly announced SiP using Transphorm GaN. It enables manufacturers to develop a less expensive system solution given fewer components are required and a smaller PCB can be used among other advantages. It also reduces system development time,” said Tony Lin, President of Weltrend.
WT7162RHUG24A Specifications and Features
The new SiP integrates Weltrend’s WT7162RHSG08 multi-mode flyback PWM controller with Transphorm’s 240 milliohm, 650 volt SuperGaN® FET. The surface mount device is available in a 24-pin 8×8 QFN package, reducing PCB size. Other key specifications include:
- Peak Power Efficiency: > 93%
- Power Density: 26 W/in3
- Wide Output Voltage Operation: USB-C PD 3.0 and PPS 3.3V~21V
- Max Frequency: 180 kHz
- Targeted Topology: Flyback with QR Mode/Valley-switching Multi-mode Operation
Target Applications and Availability
The WT7162RHUG24A SiP is optimized for use in high-performance, low-profile USB-C power adapters for mobile/IoT devices such as smartphones, tablets, laptops, headphones, drones, speakers, cameras, and more.
Device samples will be available in Q2 of 2023; contact [email protected] for availability updates.