Editorial Team

AVX Corporation, a leading manufacturer of passive components and interconnect solutions, has released a new interactive product selector guide for its medium and high power film capacitors, which are well-known for their self-healing…

NXP Semiconductors N.V. (NASDAQ: NXPI) and Freescale Semiconductor, Ltd. (NYSE: FSL) announced that they have entered into a definitive agreement under which NXP will merge with Freescale in a transaction which values the combined…

Baselworld, Switzerland, 19 March 2015 — TAG Heuer, Google and Intel have announced a partnership to launch a Swiss smartwatch powered by Intel® technology and Android Wear.

Mentor Graphics Corporation (NASDAQ: MENT) today announced its new Xpedition® Package Integrator flow, the industry’s broadest solution for integrated circuit (IC), package, and printed circuit board (PCB) co-design and optimization.

STMicroelectronics (NYSE: STM), a global semiconductor leader serving customers across the spectrum of electronics applications, has announced its contribution to the innovative Prizm™ smart audio device, which automatically plays the…

NKK Switches announces the release of its FR series of 10 mm, ultra-thin DIP rotary switches, a cost-effective alternative to the more expensive DIP rotaries currently available in the market.

SAN JOSE, Calif.--(BUSINESS WIRE)-- Power Integrations (Nasdaq:POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, announced a new family of Qspeed™ 150 V diodes.

Bourns, Inc., a leading manufacturer and supplier of electronic components, today introduced an additional semi-shielded power inductor product offering one of the industry's widest selections of footprint, profile and inductance value…

Composite materials used in aircraft wings and fuselages are typically manufactured in large, industrial-sized ovens: Multiple polymer layers are blasted with temperatures up to 750 degrees Fahrenheit, and solidified to form a solid,…

The new TI SensorTag is based on the CC2650 ultra-low power wireless MCU, offering a ®-M3 and a fraction of the power consumption compared to previous Bluetooth® Smart products. It also includes cloud support, letting you move your sensor…

Acquisition strengthens security solutions across a broad range of applications Eindhoven, Netherlands, March 10, 2015 - NXP Semiconductors N.V. (NASDAQ:NXPI) today announced that it will acquire Athena SCS Ltd., a provider of solutions…

Bourns, Inc., a leading manufacturer and supplier of electronic components, today announced new high voltage thick film chip resistor devices optimized for high voltage and consumer electronics applications. The new Bourns® Model CHV series…

SAN JOSE, Calif.--(BUSINESS WIRE)-- Power Integrations (Nasdaq: POWI), the leader in high-voltage integrated circuits for energy-efficient power conversion, today announced RDK-420, a new reference design kit for a 10 W CV/CC USB charger…

Eindhoven, Netherlands, April 14, 2015 – NXP Semiconductors N.V. (NASDAQ: NXPI) today announced the introduction of its latest UCODE product, UCODE DNA, the world’s first UHF (ultra-high frequency) RAIN RFID tag IC to combine long-range…

San Jose, California – NXP Semiconductors N.V. (NASDAQ: NXPI), a provider of Internet-of-Things (IoT) solutions, today announced it added low power mesh compatibility into its Bluetooth® Smart portfolio, recently acquired from Quintic’s…