Engineering 101

20 Things That Happened at APEC 2019

APEC 2019 News

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If you’re not in Anaheim, but still want to know about the latest happenings at the Applied Power Electronics Conference (APEC), eeDesignIt brings you a list of this week’s APEC highlights.

  1. UnitedSic and Analog Devices, Inc. entered a long-term supply agreement. (Source)
  2. ON Semiconductor introduced new industrial and automotive qualified SiC MOSFETs to complement its growing ecosystems and bring wide bandgap performance benefits to rapid growth applications.
  3. Keysight announced Power Electronics Professional (PEPro) software, a new add-on to PathWave Advanced Design System (ADS) that enables designers to visualize effects of switched-mode power supply (SMPS) designs without the need to build and test time-consuming prototypes. (Source)
  4. TDK unveiled the world’s smallest point-of-load DC-DC converter (Source)
  5. Efficient Power Conversion (EPC) demonstrated its latest eGaN FETs and ICs in customers’ end products that are enabled by eGaN technology. The company will also have presented 11 presentations by end-of-week. (Source)
  6. Renesas showed off intelligent power solutions focused on designing for power in the IoT world. (Source)
  7. StratEdge Corporation showcased high-power semiconductor package design and assembly, including the LL family of leaded laminate copper-moly-copper (CMC) base packages and its off-the-shelf line of molded ceramic packages that can be configured to meet the requirements for chips with frequencies up to 18 GHz. (Source)
  8. Vishay Intertechnology showcased its latest MOSFET, IC, passive component, and diode technologies, highlighting applications like DC/DC conversion, power factor correction, energy storage, current limiting, and temperature sensing. (Source)
  9. MaxLinear showcased its new switch mode DC/DC dual 13A power module. (Source)
  10. Murata announced the world’s smallest, most efficient, fully integrated 6A buck regulator. (Source)
  11. VicIC Technologies announced the availability of its On-Board-Charger (OBC) reference design for the fast-growing Electrical Vehicle (EV) market. The 6.7kW OBC features size and weight of only 2.3L and 4.5kg respectively, providing close to 3kW/L power density and proving the disruptive capability of GaN switches. (Source)
  12. Texas Instruments expanded its portfolio of over 500 linear regulators by introducing a first-of-its-kind smart AC/DC linear regulator. (Source)
  13. Silicon Labs introduced a family of isolated analog amplifiers, voltage sensors and delta-sigma modulator (DSM) devices designed to provide accurate current and voltage measurement with very low drift across temperature. (Source)
  14. Panasonic showcased its GaN/SiC power devices. (Source)
  15. Richardson RFPD highlighted GaN and SiC technologies in wireless charging and DC fast charging applications, as well as passive and thermal products optimized for GaN and SiC and charging applications. (Source)
  16. Wolfspeed launched three new demonstrations to show how its products are designed to withstand harsh conditions without compromising efficiency. Demonstrations included: 6.6kW onboard charger featuring surface mount MOSFET technology, a buck-boost evaluation kit for industrial applications, and a 60kW solar boost converter. (Source)
  17. Thermik showcased a range of thermal protectors. (Source)
  18. Microchip showed off efficient and smart power solutions. (Source)
  19. Navitas displayed GaNFast charging technology. (Source)
  20. Mouser is on site providing information about All Things IoT and its Empowering Innovation Together program featuring Grant Imahara. Mouser is providing interactive information about the latest power management solutions, new product advancements, and component innovations from suppliers including Analog Devices, Harwin, Infineon Technologies, Intel®, Maxim Integrated, MEAN WELL, NXP Semiconductors, ON Semiconductor, ROHM Semiconductor, Silicon Labs, STMicroelectronics, TDK Lambda, Texas Instruments, and Würth Elektronik. (Source)

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