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Microchip Introduces 3V 16-Mbit, 32-Mbit and 64-Mbit Serial Quad I/O™ Interface SuperFlash® Memory Family FeaturedUncategorized May 25, 2015 byeeDesignIt Editorial
Temperature Sensors: Lineup Of High-Precision IEC 0402 SMD NTC Thermistors Expanded Featured May 25, 2015 byeeDesignIt Editorial
NXP Announces Revolutionary New Resonant LLC GreenChip Platform with Industry Leading Low-Load Efficiency and Ease-of-Design FeaturedPower May 25, 2015 byeeDesignIt Editorial
Xilinx Launches Next Generation of Video over IP Connectivity Solutions to Address Emerging All IP-Based Networks Featured May 25, 2015 byeeDesignIt Editorial
Freescale Expands Ultra-Low-Power MCU Portfolio with New Kinetis KL17/27 32/64KB MCUs Featured May 25, 2015 byeeDesignIt Editorial
Keysight Technologies Introduces MultiScope Application, Ideal for Testing High-Speed Multilane Devices with up to 40 Channels Featured May 25, 2015 byeeDesignIt Editorial
Intersil Unveils Synchronous Buck Regulator with Output Tracking and Sequencing for FPGAs and Microprocessors PowerTrending May 25, 2015 byeeDesignIt Editorial
ALIAS Prepares for Accelerated Take-Off Aerospace & DefenceFeatured May 25, 2015 byeeDesignIt Editorial
600W High Voltage Models Finalize Extensive Z+ Series of Programmable Power Supplies Featured May 25, 2015 byeeDesignIt Editorial
C&K Components Introduces 6mm SMT Side-Actuated Tactile Switches PTS645V FeaturedPassives May 25, 2015 byeeDesignIt Editorial
Simpler wiring up with connector with bridge block ConnectivityConnectorsFeaturedUncategorized May 25, 2015 byeeDesignIt Editorial
Power Integrations’ New Charger Design for Smart Mobile Devices Showcases High Power Density Capability of InnoSwitch ICs FeaturedOptoelectronics May 25, 2015 byeeDesignIt Editorial
KEMET Introduces High Voltage Snap-In Aluminum Electrolytic Capacitors FeaturedPassives May 25, 2015 byeeDesignIt Editorial
Silicon Labs And Digi-Key Challenge Developer Innovation With “Your IoT” Design Competition FeaturedOptoelectronics May 25, 2015 byeeDesignIt Editorial
Intersil Announces Industry’s Most Highly Integrated Power Management ICs for Ultrabooks and Tablets SemiconductorsTrending May 25, 2015 byeeDesignIt Editorial
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Engineer improves rechargeable batteries with MoS2 nano ‘sandwich’ FeaturedPower May 25, 2015 byeeDesignIt Editorial
New TI DLP® chipset for automotive head-up display enables widest field of view in the industry Featured May 25, 2015 byeeDesignIt Editorial
TI Launches The Industry’s First Online Classroom For Analog Design Featured May 25, 2015 byeeDesignIt Editorial